SIFusion Press Releases

Ferrotec Acquires Integrated Materials, Inc.

Fri, 10 Sep 2010 04:27:14 +1000

Ferrotec Acquires Integrated Materials, Inc.Adds SiFusion Materials and Process Technology to Line of Advanced Materials for Semiconductor Manufacturing SANTA CLARA, Calif., July 12 /PRNewswire/ -- Ferrotec (USA) Corporation, a global supplier of materials, components, and precision system solutions, today announced that it has expanded its offering of advanced materials for semiconductor manufacturing with the purchase of Integrated Materials, Inc. and its patented SiFusion™ process for manufacturing poly silicon furnaceware. SiFusion materials will complement Ferrotec's existing line of advanced materials for semiconductor manufacturing that include fabricated quartzware and advanced ceramics.

SiFusion technology overcomes the yield, cost and environmental barriers associated with traditional semiconductor thermal process consumables. Using the same material as the wafer itself, SiFusion's pure poly silicon furnaceware reduces exposure to process contaminants. By reducing process contaminants, SiFusion significantly cuts requirements for system maintenance and consumable replacement, lowering overall total cost of ownership while improving yields.

"As Ferrotec continues to expand our line of advanced materials for semiconductor manufacturing, we maintain our commitment to precision manufacturing and process technologies that improve our customers' products and yields," said Eiji Miyanaga, president and CEO of Ferrotec (USA) Corporation. "With the addition of SiFusion patented furnaceware technology to our line of high-purity advanced materials for semiconductor manufacturing, we expect to significantly expand the adoption of this unique solution."

"Our patented SiFusion process for fabricating poly silicon furnaceware has delivered significant value to our growing list of satisfied customers, but as a start-up we have wrestled with resource and infrastructure challenges that have limited our ability to grow," said Dan Rubin, president and CEO of Integrated Materials, Inc. "With Ferrotec's extensive material fabrication infrastructure, its strong global footprint and its reputation with the world's leading semiconductor manufacturers and OEMs, we expect significant acceleration for our market acceptance and growth."

The terms of the transaction were not disclosed.

More About Ferrotec

Founded in 1980, Ferrotec Corporation (JASDAQ: 6890 (OTC)) is a worldwide leader in the supply of materials, components, and precision system solutions for businesses and products. For additional information about Ferrotec products, visit the company's web site at www.ferrotec.com.

More about Integrated Materials, Inc.

Integrated Materials, a silicon science and technology company, is dedicated to advancing semiconductor manufacturing through improved technologies and processes. Its SiFusion™ technology enables the first pure poly silicon furnaceware, a breakthrough solution for front-end thermal processes. Prior to this acquisition, Integrated Materials had several Venture Capital investors including Alloy Ventures (www.alloyventures.com), American River Ventures (www.arventures.com), and Labrador Ventures (www.labrador.com). For more information about Integrated Materials or SiFusion, visit the company's web site at www.sifusion.com

PR Contact:

Tom McKee

Marketing Communications Manager

pr@ferrotec.com

408-964-7700

IMI Announces Breakthrough "SUMMIT" Technology for Silicon Nitride LPCVD Applications

Thu, 11 Dec 2008 05:37:41 +1100

SUNNYVALE, Calif. – (Dec. 3, 2008) – Integrated Materials®, Inc. (IMI), a silicon science and technology company, today announced a major research breakthrough that will significantly improve performance and extend the life of the companies SiFusion™ brand of ultra-pure polysilicon furnace-ware for Silicon Nitride (SiN) LPCVD applications. The unique patent pending approach is expected to enable unprecedented gains in SiN furnace productivity by dramatically extending the time between preventive maintenance events and reducing particle defects. The technology works by modifying the molecular properties of the polysilicon surface enabling a surface state that is best suited to the promotion of film adhesion and stress management.

“The “Surface Modification and Molecular Incorporation Treatment” (SUMMIT) process is a novel process that increases the adhesive force between the surface of silicon and high stressed films, such as SiN film,” said Dr. Sang In Lee, Chief Technology Officer of IMI. “By combining with IMI’s proprietary surface treatment, the SUMMIT process enhances the productivity and the performance of IMI’s silicon hotzone by giving better particle performance and a longer mean time between clean (MTBC) than Quartz and SiC furnaceware.”

Evaluation of the production worthiness of the technology is underway at multiple customer sites in parallel with joint evaluation at IMI’s Strategic Marketing partner, Tokyo Electron. IMI believes this breakthrough will extend its lead in performance for SiN applications significantly beyond the reach of its competitors, further demonstrating the technological differentiation of its SiFusion™ ultra-pure polysilicon product line.

"We believe that our new solution will facilitate more effective utilization of batch furnace Silicon Nitride processes at current technology nodes and enable extension of current batch furnace processes to future nodes. This advancement will clearly enhance productivity, but more importantly reduce particles and improve yield." said Daniel Rubin, Chief Executive Officer of IMI. "The development of the SUMMIT process marks the biggest advance in furnaceware since the introduction of SiFusion™ ultra-pure polysilicon furnaceware in 2004".

Furnaceware is the widely used term for consumable parts that make up the process chamber in an LPCVD semiconductor furnace. By adopting the SUMMIT process across its full 200mm and 300mm SiN product line, comprised of towers, pedestals, liners, injectors, baffles and dummy wafers, IMI offers a complete solution to customers in search of a significant improvement in SiN performance and cost. About Integrated Materials, Inc.

With its patented SiFusion™ technology, Integrated Materials, Inc., Sunnyvale, Calif., is the first and only company to perfect the polysilicon furnace fixtures solution sought for years by the semiconductor industry. Integrated Materials’ unique family of SiFusion™ polysilicon furnaceware eclipses traditional quartz and silicon carbide consumables by its ability to increase yield by reducing particles in LPCVD as well as trace metal contamination and slip reduction in high temperature processes. SiFusion™ furnaceware improves productivity and reduces cost with the significant reduction of routine cleaning.

www.sifusion.com.

Contact: Integrated Materials, Inc. +1-408-437-7591

Fergal O’Moore (ex.279) fomoore@integratedmaterials.com

Tokyo Electron Limited (TEL) and Integrated Materials, Inc. (IMI) Announce Joint Strategic Marketing Alliance Program

Wed, 22 Oct 2008 10:02:28 +1100

Tokyo, JAPAN- November 29, 2007 - Tokyo Electron Limited (TEL) and Integrated Materials, Inc. (IMI) announced plans to jointly promote their most advanced furnace systems and SiFusion™ furnace consumables.

Under this agreement, TEL designates IMI as a strategic supplier making IMI products as its preferred furnace consumables and has an exclusive right to use IMI’s SiFusion™ 100% pure poly silicon furnace consumables for LPCVD Poly applications. It is expected that IMI’s SiFusion™ products will enable customer to improve TCO (Total Cost of Ownership) by reducing preventive maintenance (PM) cycles, and cleaning costs, while increasing furnace availability. IMI’s proprietary SiFusionTM surfaces allow TEL furnace systems to accumulate 5 to 20 times more Poly LPCVD film deposition before a PM.

“TEL is always interested in adopting a new technology that will benefit customers.” said Hiroshi Takenaka, Corporate Director of TEL and Senior Vice President and General Manager of Thermal Processing System Business Unit. “We expect this alliance will provide better overall furnace system performance to customers at lower overall cost of ownership.” Daniel Rubin, President and CEO of IMI commented “IMI is the first and the only company that has technologies to manufacture production proven furnace consumables with 100% pure poly silicon material. Together with TEL’s most advanced furnace systems, we expect to provide high purity, low maintenance, and improved cost of ownership furnace solutions to IC manufacturers worldwide.” TEL and IMI believes this alliance will provide customers with value added furnace solutions and both parties are currently discussing expansion of the alliance for other applications.

About Integrated Materials, Inc. With its patented SiFusion™ technology, Integrated Materials, Inc., Sunnyvale, Calif., is the first and only company to perfect the poly silicon furnace fixtures solution sought for years by the semiconductor industry. Integrated Materials’ unique family of SiFusionTM poly silicon furnaceware eclipses traditional quartz and silicon carbide consumables by its ability to increase yield by reducing particles in LPCVD as well as trace metal contamination and slip reduction in high temperature processes. SiFusionTM furnaceware improves productivity and reduces cost with the significant reduction of routine cleaning. www.sifusion.com

Contact: TEL Thermal Processing Systems Business Unit Shingo Tada: +81-3-5561-7381
teddy.tada@tel.com

Contact: Integrated Materials, Inc. +1-408-437-7591
Ilsong Lee(ex.242) ilee@integratedmaterials.com Atsushi Kishida (ex.232) akishida@integratedmaterials.com

ハイニックスセミコンダクターはインテグレーテッドマテリアルズのSiFusion Furnacewareの採用を決定

Thu, 14 Sep 2006 02:16:45 +1000

Sunnyvale, Calif. – Sept. 13, 2006 – Integrated Materials, Inc. announces that Hynix Semiconductor, Inc., a leading supplier of semiconductor memory products, selected Integrated Materials’ SiFusionTM furnaceware for its 300 mm production line in Ichon, Korea. IMI's SiFusionTM boats will be used in LPCVD processes for the manufacture of advanced memory chips.

SiFusionTM pure poly silicon boats eliminate the frequent routine cleaning required by competing silicon carbide and quartz products increasing available furnace production time and generating cost savings for the fab. With the adoption of SiFusion boats, Hynix anticipates improved process stability, enhanced throughput and lower overall defect rates.

"We are excited to provide Hynix with the furnaceware it needs to realize more effective furnace utilization and superior process performance," said Tom Cadwell, president and CEO of Integrated Materials. "SiFusion furnaceware opens the door for higher throughput, lower costs and easier process migration to next generation 65 nanometer and 45 nanometer designs."

Qualification Test Results

Overall results of Hynix's qualification testing data show SiFusionTM easily met Hynix's stringent production criteria, which were unachievable for competing products. The testing data revealed significant cost savings compared to alternative solutions.

"After testing the SiFusionTM 300 mm boats it is clear that these boats are easily integrated into our system," a Senior Engineering Manager at Hynix Semiconductor, Inc. stated. "In addition, we saw increased tool uptime and improved process performance which allows Hynix to increase production of the latest memory products that our customers seek."

About Hynix Semiconductor, Inc. Hynix Semiconductor Inc. (HSI) of Ichon, Korea, is a leading supplier of semiconductor memory products to a wide range of customers. Further information about Hynix is available at www.hynix.com.

SiFusion Furnaceware Gains Tool of Record Status for Fab's Oxide Anneal Process

Wed, 13 Sep 2006 02:27:08 +1000

Measurable Yield Gains with SiFusion Contribute to Growing Industry Adoption

Sunnyvale, Calif., September 12, 2006 – For the first time, a major semiconductor manufacturer has specified SiFusion™ furnaceware from Integrated Materials Inc. as the tool of record for the fab's oxide anneal process. The 300 mm U.S. fab converted all furnaces in operation at its facility to SiFusion poly silicon furnaceware after experiencing significant overall device yield improvements in this high temperature process. SiFusion furnaceware enabled these gains with its pure poly silicon composition, which lowers ionic contamination and reduces mechanical stress during the high temperature process.

This tool of record facility uses the SiFusion high temperature, long finger boat in the manufacture of complex, state-of-the-art devices at the 90 nm node. It conducted a yearlong evaluation and qualification of SiFusion furnaceware against other options in the oxide anneal process. The improved device yield and reliability of SiFusion exceeded the performance of alternative components.

In addition to achieving tool of record status at this U.S. fab, SiFusion boats have been qualified by two Asian fabs, which are gradually populating their oxide anneal processes with SiFusion furnaceware. An additional Asian fab is actively working toward qualification. Each of these three facilities has realized significant measurable yield gains during SiFusion furnaceware testing.

SiFusion Advantages for Oxide Anneal

Key to the oxide anneal process is wafer handling, support and maintaining an ionically pure environment. Accidental breakage or contamination cut short the lifespan of silicon carbide and quartz boats. Thus far, none of Integrated Material's customers have needed to replace a high temperature SiFusion boat used in the oxide anneal process.

SiFusion poly silicon furnaceware significantly reduces contact point damage, lowers mechanical stresses on the wafer and lowers ionic contamination. These benefits result directly from the poly silicon material used to construct SiFusion furnaceware. Poly silicon matches the device wafer’s Coefficient of Thermal Expansion and is 20 times "softer" than the competing silicon carbide material. In addition, because the SiFusion boat that holds the wafer is made from a gas phase deposition process, it is one of the purest materials known.

"SiFusion's poly silicon material gives any fab a competitive advantage for yield enhancement," said Tom Cadwell, Integrated Materials president and CEO. "As IC devices get smaller and smaller, a technology such as SiFusion becomes the innovation that allows the industry to advance through the stress and contamination barriers created by traditional materials."

SiFusion furnaceware offers a significant advantage over quartz and silicon carbide consumables of oxide anneal at 300 mm. Because of the substantial size and weight increases in 300 mm wafers over 200 mm wafers, the impact of an oxide anneal process on device yields is much greater, primarily due to the stress of holding the wafer. In addition, 300 mm processes are generally used to manufacture leading-edge devices incorporating smaller design architectures. As a result, these processes tend to be much more sensitive to ionic contamination. SiFusion technology positively affects contamination issues.

In addition to the oxide anneal environment, SiFusion is also suited to other high temperature and LPCVD semiconductor manufacturing processes.

CEO of Brooks Automation Joins Integrated Materials Board of Directors

Fri, 14 Jul 2006 03:05:35 +1000

SUNNYVALE, Calif., July 11, 2006 – Integrated Materials, Inc. has named Edward C. Grady, president and CEO of Brooks Automation, to its board of directors. Integrated Materials, a silicon science and technology company, is dedicated to advancing semiconductor manufacturing through improved technologies and processes. Its SiFusion™ technology enables the first pure poly silicon furnaceware, a breakthrough solution for front-end thermal processes.

Grady brings to the board 30 years of experience in engineering, sales, product marketing, strategic marketing and management of profit and loss operations. He joined Brooks in 2003, and prior to that, ran several divisions at KLA-Tencor, helping grow the business to more than $1 billion in revenues. He also has served as president and CEO of Hoya Micro Mask, driving restructuring and cost reduction initiatives to transform the business from a loss to a profit in two years.

Brooks Automation provides manufacturing efficiency solutions for semiconductor and other complex manufacturing industries. In addition to best-in-class hardware and software products and services, Brooks offers integrated solutions to optimize manufacturing equipment, factory productivity and enterprise efficiency.

“Integrated Materials is clearly a forward-thinking company with a breakthrough technology that will move fabs toward greater productivity and lower costs in the 200 mm and 300 mm thermal processes,” Grady says. “I’m enthusiastic about supporting this firm to bring its solution to the industry.”

Grady began his career as an engineer for Monsanto/MEMC, and in 14 years rose to vice president of worldwide sales for the EPI division of MEMC. He holds a bachelor’s degree in engineering from Southern Illinois University and a master’s in business from the University of Houston.

In March of this year, Integrated Materials launched its SiFusion pure poly silicon fixtures for semiconductor fabrication furnaces, based on its patented SiFusion technology. The company is also conducting a search for a new site for its Asian manufacturing and support center to aid Integrated Materials in its growth strategy to expand services to Asian semiconductor manufacturers.

Integrated Materials Offers
Poly Silicon Furnace Liner

Wed, 12 Jul 2006 08:11:27 +1000

SiFusion Product Line Drastically Reduces Preventive Maintenance for Semiconductor Furnace Processes

SEMICON West, Booth 2502, San Francisco, and Sunnyvale, Calif., July 11, 2006 – Integrated Materials announces the global introduction of its pure poly silicon SiFusion™ liner for semiconductor furnace processes. This innovative new product is now available in limited quantities for ”beta” phase validation at selected customers. The liner fixture completes the SiFusion suite of furnaceware, which includes furnace boats, injectors and pedestals.

By using the pure poly silicon liner along with other SiFusion products, fabs can fully realize poly silicon’s potential to outperform traditional quartz and silicon carbide consumables. These advantages include significantly less furnace downtime for cleaning and component replacement, reduced particle counts and lower cost of ownership.

“With the introduction of the liner to the SiFusion furnaceware suite, fabs can eliminate time-consuming and costly practices they’ve been forced to employ with traditional furnace consumables,” said Tom Cadwell, president and CEO, Integrated Materials Inc. “SiFusion furnaceware raises the performance bar for thermal processes, delivering increased furnace throughput, significant cost benefits and improved process performance.”

Less furnace downtime

All furnace components require preventive maintenance when they reach a designated micron level. This exercise, even if just for a single fixture, requires the entire furnace system to go offline. SiFusion furnaceware can completely eliminate routine cleaning, greatly improving production capacity utilization rates. By eliminating machine downtime for routine cleaning and subsequent machine recalibration, fabs can achieve greater throughput and capacity utilization for each furnace.

Reduced particle generation, metallic contamination

Each component in the furnace can contribute to wafer defect. Parts constructed from silicon carbide and quartz release particles at a significantly higher rate than poly silicon. SiFusion’s ionically pure poly silicon base material produces significantly fewer particles and releases no trace metals that can negatively impact wafer performance and yield. By adopting SiFusion for all fixtures, fabs achieve a proportionately lower rate of defects.

Lower cost of ownership

Recently confirmed in a cost-of-ownership analysis by Williams Wright & Kelly, Inc. (WWK), SiFusion’s superior record for production utilization rates, good wafers out per week, annual cleaning costs, annual component consumption and annual breakage risk add up to a lower overall cost of ownership than silicon carbide or quartz alternatives.

SiFusion Liners

In conjunction with injectors and boats, SiFusion liners are an essential element of the semiconductor LPCVD furnace. Liners provide a uniform path for the gas flow from inlet to exhaust and act as an ultra pure barrier preventing particles from the outer furnace tube from affecting product yields.

SiFusion liners feature a patented surface treatment that diffuses thermal stress and allows the structure to maintain its integrity through high temperature cycling, positively impacting furnace uptime, defect rates and yield.

The liners are ideal for 200 and 300 mm vertical furnace process applications, including high temperature, LPCVD and HTO. SiFusion liners are already under qualification at fabs in Japan, Korea and Singapore. Initial performance data indicate unparalleled low particle levels when the SiFusion liner and boat are used together.

Availability

The SiFusion liner and other furnaceware products are available through Integrated Materials’ global sales team. Visit www.sifusion.com to find a local representative.

Integrated Materials to Announce Addition to SiFusion Furnaceware Lineup

Sat, 01 Jul 2006 03:43:51 +1000

SiFusion Customer Performance Data Demonstrate Measurable Yield Gains

WHO: Integrated Materials, Inc., Sunnyvale, Calif., a silicon science and technology company, is the first and only company to perfect the manufacture of poly silicon furnace fixtures for semiconductor manufacturing. Its SiFusion technology, enabling the first pure poly silicon furnaceware, provides a breakthrough solution for front-end thermal processes. SiFusion™ poly silicon furnaceware improves fab productivity and reduces costs for 200 mm and 300 mm thermal processes.

WHAT: Integrated Materials will announce a major addition to its lineup of SiFusion furnaceware that offers fabs improved furnace uptime, defect rates and throughput.

SiFusion furnaceware, including boats, injectors, and pedestals, will be on display at Integrated Materials’ booth (#2502, South Hall) as well as the new addition to its SiFusion product lineup that will be revealed at the show.

Additionally, Integrated Materials will share customer performance data that demonstrate measurable yield improvements related to SiFusion. A recent quantitative analysis from Wright Williams & Kelly on SiFusion’s cost of ownership for silicon nitride applications will be available along with a new second WWK study that examines SiFusion in the polysilicon process.

Integrated Materials’ SiFusion furnace components are gaining momentum with semiconductor fabs, by improving performance over traditional silicon carbide and quartz consumables. SiFusion furnaceware leverages its ionically pure poly silicon base material to reduce defect density, eliminate routine cleaning and reduce total cost of ownership across thermal processes. SiFusion 300 mm shelf boats were recently selected by Aviza Technology to serve as the designed-in component for their RVP-300_plus™ diffusion furnaces.

SiFusion applications include:

High temperature processes up to 1350°C
LPCVD processes, including silicon nitride and polysilicon
HTO
200 mm and 300 mm fab environments
Compatibility with all major furnace OEM systems

WHEN & WHERE:
July 11-13, 2006
SEMICON West 2006
Booth #2502, South Hall
Moscone Center
San Francisco, Calif.

Integrated Materials, Inc. Raises $8.5M Series B Funding

Sat, 24 Jun 2006 06:52:01 +1000

May 26, 2004 - Integrated Materials, Inc. (IMI), the manufacturer of All-Silicon products vital to semiconductor diffusion processes, closed an $8.5 million Series B financing with investments from Alloy Ventures, Labrador Ventures and Rocket Ventures.

"This Series B funding allows IMI to ramp its manufacturing operations and expand its sales program to integrated circuit manufacturers worldwide," stated Tom Cadwell, IMI's president and CEO.

"Labrador's investment was motivated by the clear technical advantage of this material science breakthrough, the $1B market available, and the experienced and talented management team," stated Sean Foote of Labrador Ventures.

"Pure silicon solutions are the 'holy grail' for fabs seeking to reduce hot-zone contaminants created by quartz and silicon carbide. IMI has enabled a major step function in semiconductor manufacturing yield," added Foote.

"During our due diligence we were particularly impressed by customers at the leading semiconductor fabs wanting to expand the use of IMI's products in both their existing 200 mm lines and their new and growing 300 mm lines," stated Bob Evans of Rocket Ventures.

IMI produces and markets towers for holding silicon wafers during high temperature diffusion and deposition processes in integrated circuit production lines worldwide. IMI's products are designed to replace the existing material sets of silicon carbide and quartz with next-generation silicon technology. IMI plans to offer its customers complete furnace hot zones including tube liners and gas injectors by the end of 2004.

IMI's unique All-Silicon furnace internals deliver lower cost of ownership, improved yields and lower defect levels to customers and eliminate the need to use the environmentally un-friendly strong acids necessary to clean competing silicon carbide and quartz products. IMI's Board of Directors will be comprised of Sean Foote of Labrador Ventures as Chairman, Bob Evans of Rocket Ventures and Tom Cadwell of IMI as Board Members, and Dan Rubin of Alloy Ventures as a Board Observer.

About Integrated Materials, Inc. (IMI) Integrated Materials, Inc., located in the Silicon Valley, is the semiconductor industry's premiere manufacturer of All-Silicon products used in diffusion and RTP thermal processes.

The benefits of IMI's "Total Silicon Solution™" products used in semiconductor manufacturing include:

Crucial reductions in fixture-generated particles in LPCVD processes

Significant cost reductions via the elimination of scheduled fixture cleaning

A patented technology which eliminates fixture-generated slip in 200 mm and 300 mm wafers during high temperature processes

Reductions of fixture-generated heavy metals (<1.0E10).

Long-term evaluations by Semiconductor Manufacturers have proven that IMI's patented silicon technology delivers improvements in defect densities in the manufacture of semiconductor devices. IMI's new line of All-Silicon products enable larger process windows for new-generation integrated circuit designs utilizing 300 mm platforms -– particularly in design architectures below 100 nanometers.

IMI Secures $1 Million Order From Semiconductor Device Maker

Sat, 24 Jun 2006 06:50:35 +1000

IMI Boats Increase Yield and Accelerate Payback

Sunnyvale, California – Integrated Materials, Inc., a leading supplier of advanced boats and related consumables for diffusion and deposition furnaces used to manufacture semiconductors, announced today that the company has received a multiple unit order with a value of almost $1 million for its high temperature, poly silicon, 300 mm boats from a leading semiconductor device maker. The order is a result of a two-year joint effort to reduce thermal processing defects and increase device yields.

IMI developed its SiFusion™ Technology to address furnace process yield issues and to lower the user’s cost of ownership. According to Duncan Dobson, IMI’s vice president of marketing, “IMI designed these boats to be ‘slip-free’ with ultra high purity, and the yield impact and payback are exceptional. IMI’s boats have spurred intense interest from both the high temperature and the LPCVD process communities.”

About IMI’s SiFusion™ Technology

SiFusion™ is a patented process that provides pure poly silicon furnace internals for the manufacture of today’s advanced semiconductor devices. IMI’s silicon-on-silicon™ technology produces a friction-free wafer hot zone, significantly lowers the cost of operations and maintenance, and reduces the need for environmentally damaging chemicals. IMI’s poly silicon boats, liners, pedestals, injectors, buffers and dummy wafers offer unprecedented thermal stability and integrity and can run cleanly for up to one year before requiring routine maintenance.