Hynix Semiconductor, Inc. Selects Integrated Materials SiFusion Furnaceware

Sunnyvale, Calif. – Sept. 13, 2006 – Integrated Materials, Inc. announces that Hynix Semiconductor, Inc., a leading supplier of semiconductor memory products, selected Integrated Materials’ SiFusionTM furnaceware for its 300 mm production line in Ichon, Korea. IMI's SiFusionTM boats will be used in LPCVD processes for the manufacture of advanced memory chips.

SiFusionTM pure poly silicon boats eliminate the frequent routine cleaning required by competing silicon carbide and quartz products increasing available furnace production time and generating cost savings for the fab. With the adoption of SiFusion boats, Hynix anticipates improved process stability, enhanced throughput and lower overall defect rates.

"We are excited to provide Hynix with the furnaceware it needs to realize more effective furnace utilization and superior process performance," said Tom Cadwell, president and CEO of Integrated Materials. "SiFusion furnaceware opens the door for higher throughput, lower costs and easier process migration to next generation 65 nanometer and 45 nanometer designs."

Qualification Test Results

Overall results of Hynix's qualification testing data show SiFusionTM easily met Hynix's stringent production criteria, which were unachievable for competing products. The testing data revealed significant cost savings compared to alternative solutions.

"After testing the SiFusionTM 300 mm boats it is clear that these boats are easily integrated into our system," a Senior Engineering Manager at Hynix Semiconductor, Inc. stated. "In addition, we saw increased tool uptime and improved process performance which allows Hynix to increase production of the latest memory products that our customers seek."

About Hynix Semiconductor, Inc. Hynix Semiconductor Inc. (HSI) of Ichon, Korea, is a leading supplier of semiconductor memory products to a wide range of customers. Further information about Hynix is available at www.hynix.com.